3-d non-volatile memory device and method of manufacturing the same

作者: Ki Hong Lee , Sung Jin Whang

DOI:

关键词:

摘要: A three-dimensional (3-D) non-volatile memory device includes a plurality of word line structures extended in parallel and including interlayer dielectric layers lines that are alternately stacked over substrate, channels protruding from the substrate configured to penetrate lines, an air gap formed between structures.

参考文章(6)
Kenji Aoyama, Hisataka Meguro, Satoshi Nagashima, Semiconductor storage device and method for manufacturing the same ,(2010)
Megumi Ishiduki, Masaru Kidoh, Ryota Katsumata, Hideaki Aochi, Yosuke Komori, Yoshiaki Fukuzumi, Hiroyasu Tanaka, Masaru Kito, Non-volatile semiconductor storage device and method of manufacturing the same ,(2009)
Hideaki Aochi, Hideyuki Nishizawa, Koji Asakawa, Tsukasa Tada, Yoshiaki Fukuzumi, Shigeki Hattori, Satoshi Mikoshiba, Reika Ichihara, Hiroyuki Fuke, Masaya Terai, Nonvolatile semiconductor memory device and method for manufacturing same ,(2010)
Eli Harari, Vinod Robert Purayath, Yupin Fong, Tuan Pham, Non-Volatile Memory With Air Gaps ,(2011)