Establishing a thermal profile across a semiconductor chip
作者： Terence B. Hook , Christopher M. Schnabel , Melanie J. Sherony
DOI:
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摘要: Embodiments of the present invention disclose a semiconductor structure and method for establishing thermal profile across chip. In certain embodiments, comprises through-silicon via formed in first chip having control circuitry, wherein is manner to be thermally coupled circuitry region second chip, conducts heat from region. other forming circuitry. The also
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