Moisture-resistant electronic component, notably microwave, and method for packaging such a component
作者： Philippe Kertesz
DOI:
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摘要: A component comprises at least one support on which is fixed electronic circuit, for example a circuit of MMIC type, or more layers organic materials stacked the according to technique printed type and forming pre-existing cavity containing being filled with material low permeability water vapor such as LCP.
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