Leadframe package with integrated partial waveguide interface
作者： David R. Laidig , Michael R. Lyons , Noel A. Lopez , Kenneth V. Buer
DOI:
关键词:
摘要: A MMIC package is disclosed comprising: a leadframe based overmolded package, die positioned within the package; and partial waveguide interface, wherein interface integral with facilitating low cost reliable assembly. Also an where sits on metal portion exposed bottom of configured for attachment to chassis transceiver such that heat from easily dissipated direct thermal path. The disclosure facilitates parallel assembly packages use pick place/surface mounting technology attaching transceivers. This
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