Light irradiation module and printer
作者： Shosaku Yamanaka , 省作 山中 , Ryota Hasunuma , 亮太 蓮沼 , 山中 省作
DOI:
关键词:
摘要: PROBLEM TO BE SOLVED: To provide a light irradiation device which is difficult to be affected by the heat generated from an ultraviolet light-emitting element itself, even if mounting density of relatively high, and achieves high energy.SOLUTION: The includes 2 having substrate 10, plurality elements 20 arranged vertically horizontally on one principal surface 11a bond pads 70 located corresponding 20, respectively, other 11b planar dissipation member 100 10 2. are joined bonded via organic adhesive 90 surround inorganic bonding material 80 70, 70.
lens.org 参考文章(12)
Marc Himel, Moshe Kriman, Giles Humpston, Wafer-scale emitter package including thermal vias ,(2010)
James Petroski, Magnetic attachment method for led light engines ,(2005)
Akira Taguchi, Light irradiation device, light irradiation module and printing device ,(2011)
Yu-Cheng Lin, Jaw-Shin Cheng, Carl B Wang, Shi-Ming Kao, チェン ジョー−シン, リン ユ−チェン, カオ シー−ミン, ビー．ワン カール, Low-temperature co-fired ceramic (ltcc) tape composition, light emitting diode (led) module, illuminating devices and forming method thereof ,(2006)
秀次 波木, 士行 蟹澤, Katsuhiro Tomota, 勝寛 友田, Hideji Namiki, Shiko Kanisawa, Element, its fabrication process, substrate, its production process, mounting structure, packaging method, light emitting diode display, light emitting diode backlight and electronic apparatus ,(2006)
Uchida Shinya, LIGHT IRRADIATION MODULE AND PRINTER ,(2013)
Kinoshita Masao, Mikawa Takashi, Hiruma Takeyuki, SEMICONDUCTOR ELEMENT EPITAXIAL LAYER SEPARATING METHOD ,(2005)
Okura Hideaki, Sakatsu Tsutomu, Iwata Kazuyuki, Kuwazaki Satoshi, Yoshida Yoshihiro, MOUNTING STRUCTURE OF ELECTRONIC PART AND MOUNTING METHOD OF ELECTRONIC PART ,(2002)
Ryota Hasunuma, 亮太 蓮沼, Light radiation module and printing device ,(2012)
Nagamura Takeshi, Teshigawara Osamu, MANUFACTURE OF MULTILAYER PRINTED BOARD ,(1990)