MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering

摘要: Preface. Chapter 1: Overview of MEMS and Microsystems. 1.1 Microsystem. 1.2 Typical Microsystems Products. 1.3 Evolution Microfabrication. 1.4 Microelectronics. 1.5 The Multidisciplinary Nature Design Manufacture. 1.6 Miniaturization. 1.7 Application in Automotive Industry. 1.8 Other Industries. 1.9 Markets for Problems. 2: Working Principles 2.1 Introduction. 2.2 Microsensors. 2.3 Microactuation. 2.4 with Microactuators. 2.5 Microaccelerometers. 2.6 Microfluidics. 3: Engineering Science Fabrication. 3.1 3.2 Atomic Structure Matters. 3.3 Ions Ionization. 3.4 Molecular Theory Matter Inter-molecular Forces. 3.5 Doping Semiconductors. 3.6 Diffusion Process. 3.7 Plasma Physics. 3.8 Electrochemistry. 4: Mechanics Design. 4.1 4.2 Static Bending Thin Plates. 4.3 Mechanical Vibration. 4.4 Thermomechanics. 4.5 Fracture Mechanics. 4.6 Film 4.7 on Finite Element Stress Analysis. 5: Thermofluid 5.1 5.2 the Basics Fluid Macro Mesoscales. 5.3 Basic Equations Continuum Dynamics. 5.4 Laminar Flow Circular Conduits. 5.5 Computational 5.6 Incompressible Microconduits. 5.7 Heat Conduction Solids. 5.8 Multi-layered Films. 5.9 Solids Submicrometer Scale. 6: Scaling Laws 6.1 Introduction to Scaling. 6.2 Geometry. 6.3 Rigid-Body 6.4 Electrostatic 6.5 Electromagnetic 6.6 Electricity. 6.7 6.8 Transfer. 7: Materials 7.1 7.2 Substrates Wafers. 7.3 Active Substrate Materials. 7.4 Silicon as a Material. 7.5 Compounds. 7.6 Piezoresistors. 7.7 Gallium Arsenide. 7.8 Quartz. 7.9 Piezoelectric Crystals. 7.10 Polymers. 7.11 Packaging 8: Fabrication Processes. 8.1 8.2 Photolithography. 8.3 Ion Implantation. 8.4 Diffusion. 8.5 Oxidation. 8.6 Chemical Vapor Deposition. 8.7 Physical Deposition - Sputtering. 8.8 by Epitaxy. 8.9 Etching. 8.10 Summary 9: Micromanufacturing. 9.1 9.2 Bulk 9.3 Surface Micromachining. 9.4 LIGA 9.5 10: Microsystem 10.1 10.2 Considerations. 10.3 Process 10.4 10.5 Using Method. 10.6 Die Micropressure Sensor. 10.7 Microfluidics Network Systems. 10.8 Computer-Aided 11: Assembly, Testing 11.1 11.2 Microassembly. 11.3 High Costs 11.4 Microassembly 11.5 Major Technical Problems 11.6 Work Cells. 11.7 Challenging Issues 11.8 Packaging. 11.9 General Considerations 11.10 Three Levels 11.11 Interfaces 11.12 Essential Technologies. 11.13 preparation. 11.14 Bonding. 11.15 Wire bonding:. 11.16 Sealing Encapsulation. 11.17 Three-dimensional 11.18 Selection 11.19 Signal Mapping Transduction. 11.20 Case Pressure Sensor 11.21 Reliability 11.22 Reliability. 12: Nanoscale Engineering. 12.1 12.2 Micro 12.3 Principle Nanofabrication. 12.4 Nanoproducts. 12.5 Applications 12.6 Quantum 12.7 12.8 Nano Scales. 12.9 Nanoscale. 12.10 Measurement Thermal Conductivity. 12.11 Challenges 12.12 Social Impacts Bibliography. Index.