The hermeticity of sealed microstructures under low temperature helium and hydrogen exposure
作者： Douglas Sparks
DOI: 10.1088/0960-1317/23/1/015016
关键词:
摘要: Changes in resonator behavior the presence of helium were observed at low temperature sealed microstructures. The effects seen with microelectromechanical systems (MEMS) resonators employing reflowed glass and/or direct silicon bonded sealing interfaces. Resonator Q, peak gain and frequency all indicate degradation vacuum quality due to ingress into chamber. These between 23 100 °C after during exposure relatively pressures 140 380 kPa. Similar not for hydrogen, argon air. results may suggest diffusion through temperatures have implications hermeticity testing using MIL-STD 883E, applications a wide variety MEMS devices possibly wafer processing helium.
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