RESIN-SEALED SEMICONDUCTOR DEVICE

摘要: PURPOSE:To transmit heat generated at a semiconductor element directly to sink block having thermal conductivity larger than molding resin by oppositely disposing an ultrafine interval the and main surface of element, burying with resin. CONSTITUTION:A chip 2 on die pad 1 is bonded, blocks 6 made aluminum or copper are disposed through onto 2, this state maintained form structure that sealed 5. Since only thin layer generating from operating time can be effectively dissipated toward exterior.