Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same

摘要: A packaged semiconductor device has, according to one embodiment of the present invention, a pellet having an electronic circuit therein and electrode pads formed on principal surface pellet, plurality electrical connection bumps provided pads, heat dissipation at electrically insulated from leads for circuit, dissipators packaging material sealing bumps, parts dissipator. One or more are arranged relatively nearer than thermal coupling circuit. may be engaged with and/or thereby serving effect