作者: Paul Kaminskas , Hans Viebach , Larry Pettit , Did-Bun Wong
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摘要: A device that determines conditions under which a book cover and page delamination is more likely to occur in binder subassembly line of binding system collects stores data pertaining numerous bindery process variables such as, temperatures glue pot assembly, gas burner ambient humidity the air surrounding line, viscosity values for an emulsion glue, moisture content measurements after application backbone book. The then implements correlation analysis using stored determine if there between occurrence delamination, produces optimal value or range operation system.