Closed form vs. finite element analysis of laminated stacks

摘要: Abstract Recently, structural analysis of multi-layered stacks subjected to thermal loading has received considerable renewed interest. This is partly because popular use these structures in electronic packaging. In this paper a comparative presented. Comparisons between closed-form solution, elastic, viscoplastic and thermo-viscoplastic with damage analyses have been A mechanics based constitutive model proposed for finite element (FEA) structures. Moreover, mesh sensitivity the FEA layered stack problems studied. It shown that elastic can only be used preliminary studies method highly sensitive problem. stress singularity at free edge makes selection very difficult. On other hand, inelastic does not suffer from problem encountered analysis. The study uses thermodynamic internal state variable as metric.