作者: Richard W. Sexton , James E. Harrison
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摘要: A method is provided for fabricating a flexible circuit having at least one raised bump associated with contact pad. sacrificial conductive mandrel depression located to correspond each contact. metal pattern electroformed on selected portions of the mandrel, corresponding desired electrical lead and non-conductive polymeric sheet applied as base material circuit, laminated face thereon. An etchant, capable removing without etching or pattern, employed remove from which are laminated.