Feasibility of monolithic and 3D-stacked DC-DC converters for microprocessors in 90nm technology generation
作者： Gerhard Schrom , Peter Hazucha , Jae-Hong Hahn , Volkan Kursun , Donald Gardner
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摘要: Rapidly increasing input current of microprocessors resulted in rising cost and motherboard real estate occupied by decoupling capacitors power routing. We show analysis that an on-die switching DC-DC converter is feasible for future microprocessor delivery. The can be fabricated existing CMOS process (90nm-180nm) with a back-end thin-film inductor module. 85% efficiency 10% output voltage droop achieved 4:1, 3:1, 2:1 conversion ratios, area overhead 5% no additional capacitance. A 4:1 results 3.4x smaller 6.8x external decoupling.
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