作者: Ibrahima Ka , Yvan Avenas , Laurent Dupont , Mickael Petit
DOI: 10.1080/09398368.2017.1388626
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摘要: AbstractSemiconductor devices incorporated into power electronics systems are proven to be highly sensitive their thermal environment. Thus, temperature measurement is a key concern when it comes reliability of modules. Some Thermo-Sensitive Electrical Parameters (TSEPs) used evaluate online semiconductor components, in operating conditions converters. However, the accuracy and those TSEPs not yet fully demonstrated. To overcome this drawback, instrumented diode was developed with Resistance Temperature Detector (RTD) sensor integrated on its top metal surface. This validation tool characterized paper under constant dissipation. The embedded RTD conditioned resistance bridge circuit. A dynamic characterization realistic module performed through impedance evaluation. comparative study carried out discuss static performances ...