A 32 x 32 element row-column addressed capacitive micromachined ultrasonic transducer
作者： A S Logan , L L P Wong , A I H Chen , J T W Yeow
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摘要: This paper presents characterization and initial imaging results of a 32 × element two-dimensional capacitive micromachined ultrasonic transducer array. The devices are fabricated using wafer bonding process in which both the insulation layer membrane user-deposited silicon nitride. transducers use row-column addressing scheme to simplify fabrication beamformer. By adjusting number rows columns that biased, effective aperture can be adjusted. is significant because it permits near-field without lens. effect on transmit beam profile demonstrated. has center frequency 5.9 MHz relative bandwidth 110%. Images horizontal vertical wires taken demonstrate image resolution. A three-dimensional four pin heads also
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