作者: Robert Wodnicki , Charles G. Woychik , Albert T. Byun , Rayette Fisher , Kai Thomenius
DOI: 10.1109/ULTSYM.2009.5442074
关键词: Design for manufacturability 、 Capacitive micromachined ultrasonic transducers 、 Surface micromachining 、 Transducer 、 Multiplexing 、 Capacitive sensing 、 Computer science 、 Electrical engineering 、 Electronics 、 Interposer 、 Application-specific integrated circuit
摘要: A large area reconfigurable imaging array for research purposes is being developed with co-integrated cMUTs and control electronics. The goal a 2.5cm 2D tileable module ≫16,000 transducer sub-elements spaced at pitch of 185um in X Y dimensions. As prototype demonstration some the goals this effort, multi-row linear using external multiplexing electronics was designed fabricated. In paper challenges trenched cMUT attach to laminate interposer as part will be discussed. architecture build-up manufacturability, reliability, acoustic planarity, reduced spacing between tiles chips also addressed. Finally, first shown experimental results new cMUT-based probe presented.