Multi-row linear cMUT array using cMUTs and multiplexing electronics

作者: Robert Wodnicki , Charles G. Woychik , Albert T. Byun , Rayette Fisher , Kai Thomenius

DOI: 10.1109/ULTSYM.2009.5442074

关键词: Design for manufacturabilityCapacitive micromachined ultrasonic transducersSurface micromachiningTransducerMultiplexingCapacitive sensingComputer scienceElectrical engineeringElectronicsInterposerApplication-specific integrated circuit

摘要: A large area reconfigurable imaging array for research purposes is being developed with co-integrated cMUTs and control electronics. The goal a 2.5cm 2D tileable module ≫16,000 transducer sub-elements spaced at pitch of 185um in X Y dimensions. As prototype demonstration some the goals this effort, multi-row linear using external multiplexing electronics was designed fabricated. In paper challenges trenched cMUT attach to laminate interposer as part will be discussed. architecture build-up manufacturability, reliability, acoustic planarity, reduced spacing between tiles chips also addressed. Finally, first shown experimental results new cMUT-based probe presented.

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