Method of forming filled blind vias

作者: Manh-Quan Tam Nguyen , Raymond T. Galasco , Voya R. Markovich , Elizabeth Foster , Frank D. Egitto

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摘要: The density of electronic packaging and the electrical reliability sub-assemblies utilizing stacked blind vias are improved by providing a blind, landless via in first dielectric layer laminated to conductive metal core serving as ground plane or power plane. A hole is provided through extending core. metal, such copper, deposited electrolytically using cathode, electrolessly without seeding into hole. on progressively builds depth required for via. second first, with aligned This may be formed conventional plating techniques. Multiple layers can assembled this manner.

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