Electronic device cooling with microjet impingement and method of assembly
作者： Stanton Earl Weaver , Gary Dwayne Mandrusiak , Raj Bahadur , Hendrik Pieter Jacobus De Bock , Eric Ayres Browne
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摘要: An integrated circuit device including a die with substrate first surface and second opposite the is provided. The includes at least one element positioned on surface. Formed surface, wetting feature that an array of spaced-apart nanoscale structures and/or microscale structures. also wettability coating applied to portion spacer coupled adjacent In addition, injector plate spacer. microjet exit hole defined through plate. microjet.
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