High performance integrated mlc cooling device for high power density ics and method for manufacturing

摘要: A manifold apparatus, system and method for thermally controlling a substrate whereby body having microjet array drain traversing there-through in direction orthogonal to surface parallel each other is attached the heating or cooling thereof. cavity of resides over such that liquid emitted from microjets into contact with surface, while drains orthogonally remove spent cavity. The designed configured plurality cells, cell has surrounded by at least three preventing interactions between adjacent within cells. Gas may also traverse through form an atomized spray surface.