Morphological evolution of a void under thermal and mechanical loads
作者： Er-li Li , Xi Chen , Hua Wang , Xi Wang , Zhong-hua Li
DOI: 10.1007/S12204-009-0069-4
关键词:
摘要: A model for the morphological evolution of a void under thermal and mechanical loads is established, thermodynamics potential given based on energy principle. Thus, path bifurcation condition are described, which gives some insight into reliability interconnect combined loads.
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