Thermomigration as a driving force for instability of electromigration induced mass transport in interconnect lines

摘要: Linear instability of electromigration induced mass transport is studied as an intrinsic mechanism void nucleation and growth in interconnect lines. Heat conduction along the conductor line between surrounding materials added to a recent model, proposed by Korhonen.et al. (1993) for stress evolution, examine role thermomigration linear uniform transport. The analysis shows that leading driving force electromigration-induced This theoretical prediction seems qualitatively agree with experimental study. These results suggest thermomigration, which has been ignored most previous studies, could play significant failure