作者: Fuliang Wang , Nantian Nie , Hu He , Zikai Tang , Zhexi Chen
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摘要: A silver nanoparticle sintering method is promising for the fabrication of flexible electronics. An ultrasonic-assisted process presented to obtain conductive patterns with low resistivity on a paper-based substrate. Compared conventional hot-pressing process, proposed can efficiently fabricate densified microstructures better electrical properties at temperature and pressure. In particular, effects ultrasonic effective time, entry amplitude were systematically analyzed. It was found that lower preferred larger amplitude. The time happened during first 3 min entire which implied synergetic effect occurred very beginning stage process. Additionally, conductivity sintered obtained when shorter. mechanism also disc...