Thermoviscoelastic stresses in thin films/substrate system
作者： Win-Jin Chang , Te-Hua Fang , Cheng-I Weng
DOI: 10.1016/J.TSF.2006.09.027
关键词:
摘要: This paper utilized the viscoelastic theorem to derive thermoviscoelastic stress in a thin film/substrate structure, and obtain closed-form expression of stress. In this analysis, Maxwell model is assumed Laplace transformation applied variables time-space followed by calculation film domain. Finally, after inverse transformation, normalized at any depth time was obtained analytically expressed as function relaxation times, biaxial moduli ratio, ratio thickness between substrate. The effects different values on were analyzed results showed that significant. addition, distribution varies with depths maximum induced its surface.
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