Microcircuit machining using focused ion beams—a note on the role of SIMS for end point detection
作者： P.D. Prewett , P. Marriott , H.E. Bishop
DOI: 10.1016/0167-9317(89)90138-X
关键词:
摘要: Abstract Focused ion beams can be used for micromachining away unwanted material on IC circuits and masks. To prevent damage to underlying structures, accurate determination of the end point process is essential. Secondary mass spectrometry a highly sensitive surface analysis technique which could detection. An experimental study reveals several difficulties associated mainly with relatively high energies required high-resolution micromachining.
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