作者: Kouji Okamoto , Yoshimaro Fujii , Akira Sakamoto
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摘要: Disclosed are a back illuminated photodiode array, which is mass-producible and has an ultra-thin high-performance single-sided electrode structure, method of manufacturing the same. Both electrodes on semiconductor substrate 1, anode cathode, collected one plane substrate. The collection achieved by electrically introducing them to other via hole H penetrating 1. 1 thinned polishing, thus time for forming shortened. Moreover, during process, supporting plate 3 attached reinforcing Thus, handling wafer process becomes easy complies with mass production.