作者: Josep Montanya Silvestre , Marco Antonio Llamas Morote , Juan Jose Valle Fraga , Tayyib Sabir
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摘要: A MEMS integrated circuit including a plurality of layers where portion includes one or more electronic elements on semiconductor material substrate. The structure interconnection having bottom layer conductor and top the are separated by at least dielectric material. may be formed above in contact with an Inter Dielectric Layer. also hollow space within device communication layers.