作者: R.S. Payne , S. Sherman , S. Lewis , R.T. Howe
DOI: 10.1109/ISSCC.1995.535506
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摘要: Airbag deployment systems demand reliable, inexpensive sensing of deceleration the car during collision. The integrated accelerometer combines a 0.3 mm/sup 2/ micromechanical capacitive element with precision bipolar/MOS control circuitry in 9 area. microstructure is fabricated from layer deposited polysilicon by surface micromachining. This chip an A/V (acceleration-to-voltage) functional block for accelerations 1 to 50 g. paper reviews rationale micromachining element, BiMOS2C process, sense and circuit architecture, performance chip.