A study on fabrication of monolithic lightweight composite electronic housing for space application

摘要: Abstract This paper dealt with an alternative approach of enhancing mass savings in spacecraft avionics design by replacing conventional aluminum alloy housing widely used for various lightweight composite materials. For this purpose, key requirements were defined to build up functionalities as well more characteristics compared housing. The proposed can be equipped multiple electronics boards; and it provide mechanical electrical interfaces ease. A fabrication process was also designed overcome low machinability CFRP minimize the post-treatment such machining after curing. In addition, monolithic grid-stiffened frame fabricated co-curing through vacuum bag molding method. Its physical properties investigated regard launch environmental random load, stiffness, thermal conductivity, EMI protection. As a result, shown that have good performance comparable over having same dimension. concept electronic will effective space application.