A method for preparing and bonding ultrasonic transducers used in high frequency digital delay lines
作者： E.K. Sittig , H.D. Cook
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摘要: Cold-welding indium layers deposited on metal films constitutes a bonding method for the transducers of ultrasonic delay lines suitable operation at bit rates beyond 100 MHz. This permits use transducer materials with high coupling factor, resulting in comparatively low insertion loss.
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