作者: E.K. Sittig , A.W. Warner , H.D. Cook
DOI: 10.1016/0041-624X(69)90193-0
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摘要: Abstract Sonic devices requiring a large fractional band-width, such as delay lines, light deflectors etc., can be given low insertion loss if transducers with high electro-mechanical coupling factor are used. Such yet unobtainable by thin-film deposition methods. However, recently developed bonding and precision machining techniques, performance made various ceramic single-crystal materials. Epoxy has been useful up to 100MHz, but intermediate indium films in combination additional metal layers is shown have potential for operating 1GHz.