Molded heat exchanger structure for portable computer

摘要: In a portable notebook computer specially designed heat pipe-based exchanger assembly is used to efficiently dissipate from processor board in the computer's base housing ambient air surrounding computer. The includes graphite fiber-filled outer body which finned first portion that exposed exterior of housing, and second disposed within thermally coupled board. directly overmolded onto thermosyphoning pipe having longitudinal portions respectively encapsulated portions. During operation, conducted transmitted via balance for dissipation ambient. fin edges may have layer lower thermal conductivity plastic material suitably placed thereon serve as touch guard structure structure.