Cooling unit for electronic equipment
作者： Toshio Hatada , Shigeo Ohashi , Shinji Tanaka
DOI:
关键词: Heat transfer 、 Heat spreader 、 Heat sink 、 Hybrid heat 、 Heat capacity rate 、 Heat pipe 、 Materials science 、 Plate heat exchanger 、 Mechanical engineering 、 Plate fin heat exchanger
摘要: Heat generated at heat generating components is efficiently transported to a wall of metal box serving as dissipation section cool the even in an apparatus, which together with other are mounted. The and connected each through thermal transport device having flexible structure. readily irrespective arrangement components, by driving liquid. In section, because thermally other, high capacity obtained diffused extensively into due conductivity box.
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