Through-hole substrate and method of producing the same
作者： Takayuki Teshima
DOI:
关键词:
摘要: A substrate (3) in which a through-hole (2) is filled with filler (4) prepared, and structure (6), at least part of the surface has an insulating property, formed on (3). plated layer (7) having (6) thereon, are removed. Thus, (8) formed, opening (9) communicating provided one (1).
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