Microcoils and microrelays — an optimized multilayer fabrication process

摘要: Abstract In this paper a complete process technology for the integrated fabrication of inductive micro electromechanical systems (MEMS) is presented. The introduced comprises technologies 3D-UV–Depth Lithography, electroplating various metals and alloys, insulation planarization magnetic or electrical microstructures using benzocyclobutene (BCB) anisotropic trench etching passivation layers to incorporate metallic structures into multilayer systems. By utilizing components use in sensing, actuation microelectronics can easily be fabricated. To demonstrate applicability complex microcoils with without cores microrelay high current switching have been built by means process.