作者: Qiang Wang , Nick Birbilis , Ming-Xing Zhang
DOI: 10.1007/S11661-012-1098-4
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摘要: To understand the development of diffusion bonding, which can increase bonding strength, three different cold-sprayed coating/substrate systems were investigated, Ni/Cu, Cu/Cu, and Al/Mg, by annealing at increased temperatures for various times. The formation intermetallic compounds in Al/Mg system reduced strength dramatically. In Cu/Cu Ni-Cu, bonds developed lower as Ni-Cu forms an isomorphous system, effectively. However, higher temperature ultimately because Kirkendall pores.