Study on the Tensile Creep Behavior of Carbon Nanotubes-Reinforced Sn-58Bi Solder Joints

摘要: The microstructure and tensile creep behavior of plain Sn-58Bi solder carbon nanotubes (CNTs)-reinforced composite joints were investigated. stress exponent n under different stresses the activation energy Q c temperatures obtained by an empirical equation. results reveal that joint is refined resistance improved CNTs. improvement due to microstructural change joints, since CNTs could provide more obstacles for dislocation pile-up, which enhances values energy. steady-state rates are increased with increasing temperature applied stress. constitutive equations written as $$ \dot{\varepsilon }_{s1} = 14.94\left( {\sigma /G} \right)^{3.7} \exp \left( { - \frac{81444}{RT}} \right) $$ }_{s2} 2.5\left( \right)^{4.38} \frac{101582}{RT}} , respectively. mechanism effects lattice diffusion determined climbing.