Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders
作者： A.A. El-Daly , A.E. Hammad , G.S. Al-Ganainy , M. Ragab
DOI: 10.1016/J.MSEA.2014.04.070
关键词:
摘要: … of ternary eutectic β-Sn+Ag 3 Sn+η-Cu 6 Sn 5 phase and the primary β-Sn, respectively. For … Besides, it is probable that the higher proportion of primary β-Sn phase in SAC(305) solder …
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