The effects of flux materials on the moisture sensitivity and reliability of flip-chip-on-board assemblies
作者： C. Beddingfield , L.M. Higgins
DOI: 10.1109/3476.720416
关键词:
摘要: This paper discusses the nonproprietary aspects of work-in-progress regarding developments in flux materials to improve moisture-induced stress sensitivity flip chip plastic ball grid array devices. Studies addressing moisture characterization and preconditioning, using JEDEC Level 3, assemblies built with four proprietary fluxes two alternative underfill will be presented. report includes evaluation weight loss during a simulated die attach reflow profile for each type thermogravimetric analysis. Also, adhesion strength surface after assembly, preconditioning 48 h autoclave stressing discussed. The integrity solder joint corresponding measured pull techniques also effects experimental variables on die/substrate reviewed C-SAM imaging methods. Proprietary Motorola's FC-PBGA assembly technology not disclosed.
sci-hub.se 参考文章(9)
D.O. Powell, A.K. Trivedi, Flip-chip on FR-4 integrated circuit packaging electronic components and technology conference. pp. 182- 186 ,(1993) , 10.1109/ECTC.1993.346722
C. Takubo, N. Hirano, K. Doi, H. Tazawa, E. Hosomi, Y. Hiruta, Eutectic solder flip chip technology for chip scale package international electronics manufacturing technology symposium. pp. 488- 493 ,(1996) , 10.1109/IEMT.1996.559794
Y. Ishida, T. Katoh, S. Ishiwata, A. Omura, T. Oohara, High reliable FC-PBGA international electronics manufacturing technology symposium. pp. 104- 108 ,(1996) , 10.1109/IEMT.1996.559696
D.W. Wang, K.I. Papathomas, Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4) electronic components and technology conference. ,vol. 16, pp. 863- 867 ,(1993) , 10.1109/33.273686
D. Gamota, C. Melton, Advanced encapsulant systems for flip chip international symposium on advanced packaging materials processes properties and interfaces. pp. 46- 49 ,(1997) , 10.1109/ISAPM.1997.581252
Eugene J. Rymaszewski, Rao R. Tummala, Y. C. Lee, Microelectronics packaging handbook ,(2012)
D. Suryanarayana, R. Hsiao, T.P. Gall, J.M. McCreary, Enhancement of flip-chip fatigue life by encapsulation IEEE Transactions on Components, Hybrids, and Manufacturing Technology. ,vol. 14, pp. 218- 223 ,(1991) , 10.1109/33.76536
G. O'Malley, J. Giesler, S. Machuga, The importance of material selection for flip chip on board assemblies electronic components and technology conference. ,vol. 17, pp. 248- 255 ,(1994) , 10.1109/96.311770
D. Suryanarayana, T.Y. Wu, J.A. Varcoe, Encapsulants used in flip-chip packages electronic components and technology conference. ,vol. 16, pp. 858- 862 ,(1993) , 10.1109/33.273685