Instantaneous fluxless bonding of Au with Pb–Sn solder in ambient atmosphere
作者： Teck Kheng Lee , Sam Zhang , Chee Cheong Wong , Ah Chin Tan
DOI: 10.1063/1.1997291
关键词: Eutectic system 、 Wetting 、 Soldering 、 Wire bonding 、 Microelectronics 、 Metallurgy 、 Anodic bonding 、 Scanning electron microscope 、 Materials science 、 Electronic packaging
摘要: A fluxless bonding technique has been developed as a method of flip-chip for microelectronic packaging. The can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics action verifies effectiveness this through wetting balance tests scanning electron microscope energy dispersive x-ray analysis. demonstrated by using gold bump to break tin oxide layer over allows fast, solid liquid interdiffusion (Au) fresh eutectic lead-tin (Pb–Sn) solder joint formation during solidification. successfully tested with 130-μm-pitch bond pads on joint-in-via flex substrate architecture.
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