Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging
作者： Teck Kheng Lee , Sam Zhang , Chee C. Wong , A. C. Tan
DOI: 10.1109/TADVP.2008.2006650
关键词:
摘要: … a fluxless bonding method called solid–liquid interdiffusion bonding by compressive force (SLICF). SLICF utilizes a mechanical force to form the bond through solid–liquid interdiffusion …
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researchgate.net 参考文章(20)
Frederick G. Yost, Darrel R. Frear, F. M. Hosking, The Mechanics of Solder Alloy Wetting and Spreading ,(1993)
Ricky W Chuang, Chin C Lee, High-temperature non-eutectic indium-tin joints fabricated by a fluxless process Thin Solid Films. ,vol. 414, pp. 175- 179 ,(2002) , 10.1016/S0040-6090(02)00424-8
Jihye Lee, Jung H. Kim, Choong D. Yoo, Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Journal of Electronic Materials. ,vol. 34, pp. 96- 102 ,(2005) , 10.1007/S11664-005-0185-3
Teck Kheng Lee, Sam Zhang, Chee Cheong Wong, Ah Chin Tan, Instantaneous fluxless bonding of Au with Pb–Sn solder in ambient atmosphere Journal of Applied Physics. ,vol. 98, pp. 034904- ,(2005) , 10.1063/1.1997291
T.K. Lee, S. Zhang, C.C. Wong, A.C. Tan, A novel joint-in-via flip-chip chip-scale package IEEE Transactions on Advanced Packaging. ,vol. 29, pp. 186- 194 ,(2006) , 10.1109/TADVP.2005.850506
Teck Kheng Lee, Sam Zhang, C.C. Wong, A.C. Tan, Dissolution and reaction between Au and molten eutectic PbSn solder Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 427, pp. 136- 141 ,(2006) , 10.1016/J.MSEA.2006.04.041
G. Dehaine, P. Courant, Single point ILB at narrow pitch IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. ,vol. 17, pp. 559- 563 ,(1994) , 10.1109/96.338723
D. R. Frear, J. W. Jang, J. K. Lin, C. Zhang, Pb-free solders for flip-chip interconnects JOM. ,vol. 53, pp. 28- 33 ,(2001) , 10.1007/S11837-001-0099-3
Teck Kheng Lee, Sam Zhang, C.C. Wong, A.C. Tan, Fluxless flip chip bonding with joint-in-via architecture Thin Solid Films. ,vol. 504, pp. 436- 440 ,(2006) , 10.1016/J.TSF.2005.09.111
Chin C Lee, Selah Choe, Fluxless InSn bonding process at 140 °C Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 333, pp. 45- 50 ,(2002) , 10.1016/S0921-5093(01)01815-9