Method for manufacturing two substrates connected by at least one mechanical and electrically conductive connection and the structure obtained
作者： Jean-Charles Souriau
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摘要: A first substrate provided with a receiving area made from metallic material is supplied. second an insertion comprising base surface and at least two bumps arranged facing the substrate. The are salient surface. pressure applied between so as to make penetrate into area. reacts form continuous layer of intermetallic compound having formed by materials along interface
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