Thermally conductive graphite reinforced alloys

摘要: Embodiments of the present invention provide composite bodies having a discontinuous graphite preform and at least one silicon-bearing metal alloy infiltrant. also methods for producing such bodies. The is preferably comprised aluminum, copper, or magnesium, combinations thereof. Certain preferred embodiments aluminum from about 5% silicon to 30% silicon, more 11% 13% as an alloying element. presently aluminum-silicon eutectic composition 12.5% silicon. materials be “tuned” closely match thermal expansion characteristics number semiconductor integrated circuit as, but not limited to, alumina, nitride, gallium arsenide while providing high conductivity. are especially suited use heat sink, spreader, both.