A Spectroscopic Study of Solid-Phase Chitosan/Cyclodextrin-Based Electrospun Fibers
作者： Chen Xue , Lee D. Wilson
DOI: 10.3390/FIB7050048
关键词:
摘要: In this study, chitosan (chi)/hydroxypropyl-β-cyclodextrin (HPCD) 2:20 and 2:50 Chi:HPCD fibers were assembled via an electrospinning process that contained a mixture of HPCD with trifluoroacetic acid (TFA) as solvent. Complementary thermal analysis (thermal gravimetric (TGA)/differential scanning calorimetry (DSC)) spectroscopic methods (Raman/IR/NMR) used to evaluate the structure composition fiber assemblies. This study highlights multifunctional role TFA solvent, proton donor electrostatically bound pendant group chitosan, where formation ternary complex occurs supramolecular host–guest interactions. work contributes further insight on stability such (chitosan + solvent) electrospun their potential utility “smart” coatings for advanced applications.
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