作者: G. Zambrano , P. Prieto , F. Perez , C. Rincon , H. Galindo
DOI: 10.1016/S0257-8972(98)00686-0
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摘要: Abstract Ni doped Tungsten Carbide thin films (WC+Ni) were deposited onto stainless steel, WC–Co and glass substrates by non-reactive d.c. magnetron sputtering process using a sintered WC–6% target. The WC+Ni hard coating had thicknesses between 0.6 1.5 μm at temperatures 300°C 550°C. structure of the was characterized X-ray Diffraction (XRD), Secondary Ion Mass Spectroscopy (SIMS) Reflection Absorption Infrared (RAIRS) techniques. A morphological analysis carried out Atomic Force Microscopy (AFM) SEM, while microhardness measured nanoindentation. results confirm that WC x formation dependant on substrate temperature. AFM SEM indicated surface morphology is formed rounded grains. Hardness values deduced from microindentation curves statistical average each sample 18 GPa for all samples, same value has been found measurements bare substrate.