Research on the ultra-precision ductile cutting mechanism of KDP crystal

摘要: To achieve ductile processing of brittle materials is a key factor to obtain high quality finished surface. A new strategy was carried clarify the brittle-to-ductile transition mechanism. The KDP crystal processed by mono diamond tool with arc-nose, and plastic deformation can be found in inside chip optical microscope, also apparent transitional zone fracture along width direction chips. It inferred that plastically deforming area sensitive cutting parameter feedrate. critical thickness calculated parameters measured from At last model for calculating given.