Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device
作者： Colleen M. Butler , Hasan Sharifi , Ara K. Kurdoghlian , Keisuke Shinohara , Alexandros D. Margomenos
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摘要: A method of integrating benzocyclobutene (BCB) layers with a substrate is provided along corresponding device. includes forming first BCB layer on the and depositing metal within vias defined by layer. The also forms second deposits extends through to establish an operable connection are independent electrical any circuit element carried substrate, but secure underlying structure reduce likelihood delamination.
lens.org 参考文章(15)
Andreas Krauss, Richard Fix, Alexander Martin, Denis Kunz, Electronic component as well as method for its production ,(2009)
Kho Liep Chok, Xiaomei Bu, Meng Luo, Fan Zhang, Yee Mei Foong, Chian Yuh Sin, Luona Goh, Tae Jong Lee, Huey Ming Chong, Liang Choo Hsia, Integrated circuit with protective moat ,(2004)
Thomas D. Bonifield, Basab Chatterjee, Jeffrey Alan West, Crack deflector structure for improving semiconductor device robustness against saw-induced damage ,(2009)
Hao-Yi Tsai, Yu-Wen Liu, Hsien-Wei Chen, Structure for reducing integrated circuit corner peeling ,(2008)
Takashi Ishigami, Ryuji Tomita, Kazuyoshi Ueno, Manabu Iguchi, Tetsuya Kurokawa, Makoto Sekine, Semiconductor device with guard ring for preventing water from entering circuit region from outside ,(2004)
Haijing Cao, Yaojian Lin, Wafer level die integration and method therefor ,(2008)
Masaaki Nishijima, Daisuke Ueda, Semiconductor integrated circuit device and vehicle-mounted radar system using the same ,(2005)
Rajen Chanchani, Donald T. Bethke, Denise B. Webb, Charlie Sandoval, Gregg A. Wouters, Development and RF Characterization of High Density Integrated Substrate Technology IEEE Transactions on Components and Packaging Technologies. ,vol. 30, pp. 478- 485 ,(2007) , 10.1109/TCAPT.2007.898709
J-B Lee, J English, C-H Ahn, M G Allen, Planarization techniques for vertically integrated metallic MEMS on silicon foundry circuits Journal of Micromechanics and Microengineering. ,vol. 7, pp. 44- 54 ,(1997) , 10.1088/0960-1317/7/2/002