Crack deflector structure for improving semiconductor device robustness against saw-induced damage

摘要: An integrated circuit containing a crack deflecting scribe seal which separates an interior region of the from scribeline immediately outside and method forming same. The includes continuous metal layers contacts vias between layers. do not extend past vias. are recessed edges underlying on side seal, providing angled outer surface may desirably terminate propagation or deflect upward to top seal.