Semiconductor element and methods for manufacturing the same

作者: Dirk Meinhold , Christian Bretthauer

DOI:

关键词:

摘要: A semiconductor element and method are provided such that the includes providing a processed substrate arrangement including metallization layer structure on main surface of substrate. The further release etching for generating kerf in at separation region substrate, defining border between die least second arrangement.

参考文章(40)
Stewart Clark, David Ludwig, W. Eric Boyd, James Yamaguchi, Method for precision integrated circuit die singulation using differential etch rates ,(2005)
Poh Ching Sim, Tsui Ping Chu, Hyung Sun Yook, Reduction of fluorine contamination of bond pads of semiconductor devices ,(2009)
Yvonne Bergmann, Heribert Weber, Frank Fischer, Mirko Hattass, Hybrid integrated component and method for the manufacture thereof ,(2013)
Giuseppe Miccoli, Alfred Vater, Friedrich Steffen, Bhaskaran Jayachandran, Wafer and a Method of Dicing a Wafer ,(2007)
U-Ting Chen, Jen-Cheng Liu, Shuang-Ji Tsai, Feng-Chi Hung, Dun-Nian Yaung, Jeng-Shyan Lin, Scribe lines in wafers ,(2012)
Timothy H. Daubenspeck, Wolfgang Sauter, Jeffrey P. Gambino, Christopher D. Muzzy, Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop ,(2012)