SOLID STATE IMAGE SENSOR
作者： Tsuji Kiyoshi
DOI:
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摘要: PURPOSE:To reduce in size a solid state image sensor by conducting chip side pad electrode to package be conducted with lead provided at the for electrically connecting an exterior through bump material pattern lead. CONSTITUTION:A 90 is composed of 91, 92 mounting 93 light receiving surface 94 92, leads 95 and connected exterior, 97 on transparent member sealing 91 96. The materials 96, 96 97.
lens.org 参考文章(3)
Kaiya Haruhiko, Takamura Koji, Suzuki Hiromasa, Yabe Hisao, Hasegawa Hiroshi, SOLID-STATE IMAGE SENSING DEVICE ,(1987)
Hashimoto Takaaki, Nakahama Mikio, Shibazaki Kiyoshige, Nitta Keiichi, SOLID-STATE IMAGE PICKUP DEVICE ,(1988)
Yamanari Kenzou, SOLID-STATE IMAGE PICKUP DEVICE ,(1983)