作者: Hitoshi Shimamura , Kazuaki Takahashi , Kazuhiro Nishida
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摘要: A solid-state imaging device comprises: a element comprising body; first substrate one end face of which is bonded to and integrated with the element, on its surface an electrode for establishing electrical contact bonding wire led from pad provided frame that seals so as surround outer peripheral surfaces excluding face; sealing resin portion covers region extending including element.